Join Quantic Ohmega Ticer for an informative webinar exploring an innovative approach to electronics packaging: integrating thin-film resistors directly into organic substrates. This technique offers several key advantages, including increased miniaturization by reducing component size and maximizing board space. By eliminating vias, it also improves signal integrity, enabling smoother signal transmission and enhanced high-frequency performance. Importantly, this innovation can be seamlessly integrated into existing production processes, minimizing disruption to current manufacturing workflows.

In this webinar, we will discuss the materials and processes used to create prototype IC packages with embedded thin-film resistors. We will present data on achievable resistor values and tolerances, and explore the practical applications and potential benefits of this technology for module and integrated circuit packaging. Finally, we will discuss the future of electronics packaging and the role of this technology in advancing industry standards.

This webinar is a valuable resource for engineers, designers, and researchers involved in electronics packaging, PCB design, and high-frequency applications. Attendees will gain a deeper understanding of the benefits of integrating thin-film resistors into organic substrates, learn about the materials, processes, and performance characteristics of this technology, and gain insights into the practical applications and future potential of this innovative approach.

Don’t miss this opportunity to learn about an innovative technology that can enhance your electronics packaging designs.